Solder Paste Inspection Systems for Printed Circuit Boards

The Introduction of SPI Machine:

Using the principle of optics, SPI is a SMT detecting device for the height of the solder paste printed on the PCB board by the method of triangulation.

Detailed Description of Solder Paste Inspection Machine：

1.High precision control platform:

The motion platform adopts the servo motor and high precision ball screw structure, high-speed, stable, no vibration, no noise. With the high precision grating closed-loop feedback system.

2.High definition, high speed camera:

High frame rate industrial camera and lens to achieve the high speed photography; Self-owned intellectual property RGB light can get 2D & 3D true color image which look realistic; The GPU parallel processing technique can greatly improve the speed of calculation and detection.

3.Double projective structure grating system:

The N step phase shifting algorithm bassed on the white light moire fringe technique, providing 1um high inspect accuracy There are multiple grating for option to deal withreflection and shadow.

4.True color 3D image:

Phase measuring profilometry ( PMP ) based on the sinusoidal motion projection by structure grating, the multiple images by discrete phase shift,to calculate the phase distribution by multi- phase,the triangulation and so on to get the high-precision outline and volume of the object to be measured shown in 3D true color.

5.Humanized GUI:

The software can create the PAD information automatically by import the CAD file ( in dxf ) or the Gerber file ( in RS274-D RS274-X ), only need to set inspect parameters to finish the programming.

6.Detailed SPC analysis system：

SPC analyzed the feedback of test information to promote the improvement of the process, in order to prevent adverse. The operator can view test report visually by pie chart or column chart. And the statistical information can be exported in Html, Excel or Image format.

Specifications of Inline Solder Paste Inspection Machine for SMT Line: