Inline PCB Laser Depaneling Machine With UV Laser For Cutting PCB Panels

Inline PCB Laser Depaneling Machine With UV Laser For Cutting PCB Panels

Inline PCB Laser Depaneling Machine with UV Laser for Cutting PCB Panels Specification: Inline PCB Laser Depaneling Machine with UV Laser for Cutting PCB Panels Features: Pre-camera vision product position registration and model check Coherent Avia NX UV laser with HurrySCAN head High capacity...
Product description

Inline PCB Laser Depaneling Machine with UV Laser for Cutting PCB Panels Specification:

Laser

Q-Switched diode-pumped all solid-state UV laser

Laser Wavelength

355nm

Laser Power

10W/12W/15W/18W@30KHz

Positioning Precision of Worktable of Linear Motor

±2μm

Repetition Precision of Worktable of Linear Motor

±1μm

Effective Working Field

400mmX300mm(Customizable)

Laser Scanning Speed

2500mm/s (max)

Galvanometer Working Field Per One Process

40mmх40mm

Inline PCB Laser Depaneling Machine with UV Laser for Cutting PCB Panels Features:

Pre-camera vision product position registration and model check

Coherent Avia NX UV laser with HurrySCAN head

High capacity BOFA dust collector

User friendly Window based software

PCB flexible product jig adjustable for different board size

High resolution and accurate Z stage with auto-focus function

Large area low friction front loading platform for sliding multiple product jigs

Fully covered class 1 safety enclosure

Able to do cutting and marking together

Compact size 

Compared to conventional tools, laser processing offers a compelling series of Advantage:

The laser process is completely software-controlled. Varying materials or cutting contours are 

easily taken into account through adapting the processing parameters and laser paths.

In the case of laser cutting with the UV laser, no appreciable mechanical or thermal stresses occur.

The laser beam merely requires a few µm as a cutting channel. More components can thus be placed on a panel.

The system software differentiates between operation in production and setting up processes. That clearly reduces instances of faulty operation.

The fiducial recognition by the integrated vision system is done in the latest version around 100%

faster than before.

What are the advantages of FPC laser cutting?

FPC materials are used in various fields, such as: telecommunications industry, automotive industry, electronics industry, wire industry, etc.; but the demand for FPC materials in each field is not the same, the cutting problem of FPC circuit board is exposed, the traditional The cutting method can no longer meet the needs of each industry, but the laser cutting new high-tech technology can meet.

Laser cutting is the use of electrical energy to transfer into light energy, focus the light source on the surface of the material, and move the laser source or material to cut. The laser cutting machine can also be applied with punching, welding and dividing.

 

The advantage of Laser PCB Depaneling Machine compared with traditional cutting PCB material is that it does not require traditional stamping of several kinds of molds, saving time and cost; and Laser PCB Depaneling Machine is non-contact processing, eliminating the damage caused by traditional processing contact materials, reducing the scrap rate and greatly saving. The cost.

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