Auto Vision Positioning PCB Laser Separator Equipment

Auto Vision Positioning PCB Laser Separator Equipment

Auto Vision positioning PCB Laser Separator Equipment Description: PCB depaneling (singulation) laser machines and systems have been gaining popularity over recent years. Mechanical depanaling/singulation is done with routing, die cutting, and dicing saw methods. However, as the boards get...
Product description

Auto Vision positioning PCB Laser Separator Equipment Description:

PCB depaneling (singulation) laser machines and systems have been gaining popularity over recent years. Mechanical depanaling/singulation is done with routing, die cutting, and dicing saw methods. However, as the boards get smaller, thinner, flexible, and more sophisticated, those methods produce even more exaggerated mechanical stress to the parts. Large boards with heavy substrates absorb these stresses better, while these methods used on ever-shrinking and complex boards can result in breakage. This brings lower throughput, along with the added costs of tooling and waste removal associated with mechanical methods.

Increasingly, flexible circuits are found in the PCB industry, and they also present challenges to the old methods. Delicate systems reside on these boards and non-laser methods struggle to cut them without damaging the sensitive circuitry. A non-contact depaneling method is required and lasers provide a highly precise way of singulation without any risk of harming them, regardless of substrate.



High Precision PCB Depaneling Machine with UV Laser Feature:

Pre-camera vision product position registration and model check;

Optowave UV laser head;

High capacity dust collector;

User friendly Window based software;

PCB flexible product jig adjustable for different board size;

High resolution and accurate Z stage with auto-focus function;

Large area low friction front loading platform for sliding multiple product jigs;

Fully covered class 1 safety enclosure;

Able to do cutting and marking together;

Compact size.



Specification of PCB Laser Cutting Machine for SMT Line Product:


  

Laser

Q-Switched diode-pumped all solid-state UV laser

Laser Wavelength

355nm

Laser Power

10W/12W/15W/17W@30KHz

Positioning Precision of Worktable of Linear Motor

±2μm

Repetition Precision of Worktable of Linear Motor

±1μm

Effective Working Field

460mmX460mm(Customizable)

Laser Scanning Speed

2500mm/s (max)

Galvanometer Working Field Per One Process

40mmх40mm


Application of FPC PCB Laser Depanel Machine:

CWVC-5L-part3.jpgCWVC-5L-part2.jpg


Company Information:

We have CE and FDA certificate. Our factory locates in Shenzhen city of China. Welcome to visit us.  

1.In the processing of production, our professional technical engineers inspect the processing to ensure the quality of products.

2.Every machine must be tested before delivery for 8 hours , all of them are absolutely qualified.

3.12 months guarantee of the whole machine.

4.Main parts shall be changed free of charge if there is any problem during the warranty period.

5.Lifetime maintenance free of charge.

6.We will provide the consumable parts at an agency price when you need replacement.

7.Machine has been adjusted before delivery.

 



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