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The Introduction of Laser Soldering Machine
Apr 12, 2018

What is Laser Soldering Machine?

Laser tin-ball soldering ball is laser through fiber transmission, the output port is attached to the top of tin-ball, to provide the inlet for high-pressure gas entrance in the annular cavity, to molten solder ball, then high pressure inert gas can ensure there is enough pressure to molten solder ball dripping, guarantee the tin ball will not be oxidation, high precision, good welding effect.

Multi-axis intelligent working platform, equipped with coaxial CCD positioning and monitoring system, effectively ensures soldering accuracy and yield rate.

Technical Advantages: 

1.quickly done the process of heating and melting within 0.2s

2.melting the solder ball  in the soldering  place without  splash

3.No flux is required, no pollution, long life time of electronics

4.The smallest  diameter of the solder ball is 0.1mm, the machine meets the developing trend of integration and precision.

5. According to different size of the solder ball, the operator can solder different soldering  points.

6.The quality of the soldered product is good

7. meet the need of  massive production in assembly line with the cooperation of CCD  positioning system 

Where conventional soldering techniques reach their limits:

Laser soldering is often applied as selective laser soldering. Selective soldering processes are used in applications where other conventional selective soldering techniques reach their limits. These limits can be for example defined by temperature-sensitive components. The transfer of heat and energy through the laser beam provides the user with many advantages, especially with view to the miniaturization of sub-assemblies or sensitive components.

During the soldering process, the filler metal or alloy is heated to melting temperatures < 450°C by laser.  Therefore lasers with lower output powers (typically < 100 Watts) are used to melt the wire material, soldering paste or solder deposits so that it flows in between the two closely fitted joining materials.

For soldering small parts or components within the semiconductor, electronic or optoelectronic device manufacturing or assemblies industry, the diode laser is the right choice. Diode lasers are used for selective soldering because the laser power can be precisely controlled by an analog signal and the heat input into the material is very localized. That is why laser soldering is most advantageous, compared to traditional soldering methods. The process does not damage or input heat into nearby components. That is why even very small electronic components, in the range of a few tenths of a millimeter, as well as heat sensitive electronic parts can be processed. 

Fast power controllability combined with a non-contact temperature measurement to minimize thermal damage make the diode laser an ideal tool for this application. 

Conventional selective soldering techniques, such as e.g. the soldering iron, need a direct mechanical contact between the soldering tool and the solder joint, or the soldering tool has to be very close to the solder joint. Yet, in many cases, this is not possible due to a lack of space. Furthermore, within conventional selective soldering processes, the energy input is either not or is very slowly able to be influenced during the soldering process. 

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