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Advantages of SMT mounting process and basic process components
Apr 02, 2018

Advantages:

 

1, small electronic products. The volume of the patch component is only about 1/10 that of the conventional component. After the SMT chip is processed, the volume of the electronic product is reduced by 40% to 60%.

 

2, efficacy and low cost. SMT chip processing is easy to achieve automation, improve production efficiency, save materials, energy, equipment, manpower, time, etc., reduce the cost up to 30% to 50%.

 

3, light weight. The weight of the patch element is only 10% of that of the conventional insertion element. Generally, after using SMT, the weight is reduced by 60% to 80%.

 

4, high reliability, strong vibration resistance.

 

5, high frequency characteristics, reduce electromagnetic and radio frequency interference.

 

6, solder joint defect rate is low.


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SMT basic process components include: silk screen (or dispensing), placement (curing), spi, reflow soldering, cleaning, testing, repair.

 

1, silk screen: Its role is to paste the solder paste or patch glue printed on the PCB pad, to prepare for the welding of components. The equipment used is a screen printing machine (screen printer) located at the forefront of the SMT production line.

 

2. Dispensing: It is the glue that drops to the fixed position of PCB board, its main function is to fix the component to PCB board. The equipment used is a dispenser, located at the front of the SMT production line or behind the inspection equipment.

 

3, Mounting: Its role is to accurately install the surface mounting components to the PCB's fixed position. The equipment used is a placement machine located behind the screen printing machine in the SMT production line.

 

4. Curing: The function is to melt the patch glue so that the surface assembly components and the PCB board are firmly bonded together. The equipment used is a curing oven located behind the placement machine in the SMT production line.

 

5, SPI: After the printer, for the quality inspection of solder printing and verification and control of the printing process.

 

6, reflow soldering: Its role is to melt the solder paste, so that the surface assembly components and PCB board firmly bonded together. The equipment used was a reflow oven located behind the placement machine in the SMT production line.

 

7. Cleaning: The function is to remove the harmful solder residue on the assembled PCB, such as flux. The equipment used is a washing machine. The location may not be fixed, and it may be online or offline.

 

8. Detection: The function is to test the quality and assembly quality of assembled PCB boards. The equipment used is a magnifying glass, a microscope, an on-line tester (ICT), a flying probe tester, an automatic optical inspection (AOI), an X-ray detection system, a function tester, and the like. The location can be configured in the right place on the production line according to the need of detection.

 

9, repair: its role is to detect failure of the PCB board rework. The tools used are soldering iron, rework station, etc. Configured anywhere in the production line.

 

 








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